eutectic solder

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• Solder paste — (or solder cream) is used for connecting the terminations of the IC packages with that of land patterns on the PCB. The paste is applied to the lands by printing the solder using a stencil, while other methods like screening and dispensing are… …   Wikipedia

• Solder — A solder is a fusible metal alloy with a melting point or melting range of 90 to 450 °C (200 to 840 °F), used in a process called soldering where it is melted to join metallic surfaces. It is especially useful in electronics and plumbing. Alloys… …   Wikipedia

• eutectic-temperature solder — eutektinis lydmetalis statusas T sritis radioelektronika atitikmenys: angl. eutectic temperature solder vok. eutektisches Lötmittel, n rus. эвтектический припой, m pranc. brasure eutectique, f; soudure eutectique, f …   Radioelektronikos terminų žodynas

• eutectic alloy — noun A mixture of metals having a melting point lower than that of any of its components; they are brittle and have been used in dental solder …   Wiktionary

• Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… …   Wikipedia

• Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… …   Wikipedia

• Restriction of Hazardous Substances Directive — European Union directive: Directive 2002/95/EC Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment Made by Council Parliament …   Wikipedia

• Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …   Wikipedia

• Solid solution — Fig. 1 A binary phase diagram displaying solid solutions over the full range of relative concentrations. A solid solution is a solid state solution of one or more solutes in a solvent. Such a mixture is considered a solution rather than a… …   Wikipedia

• Gold plating — is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical means.Mechanical or chemical affixing of thin gold foils onto the surface of objects is instead known as …   Wikipedia

• Brazing — This article is about the metal joining process. For the cooking technique, see braising. Brazing practice Brazing is a metal joining process whereby a filler metal is heated above and distributed between two or more close fitting parts by… …   Wikipedia